- •Preface
- •Imaging Microscopic Features
- •Measuring the Crystal Structure
- •References
- •Contents
- •1.4 Simulating the Effects of Elastic Scattering: Monte Carlo Calculations
- •What Are the Main Features of the Beam Electron Interaction Volume?
- •How Does the Interaction Volume Change with Composition?
- •How Does the Interaction Volume Change with Incident Beam Energy?
- •How Does the Interaction Volume Change with Specimen Tilt?
- •1.5 A Range Equation To Estimate the Size of the Interaction Volume
- •References
- •2: Backscattered Electrons
- •2.1 Origin
- •2.2.1 BSE Response to Specimen Composition (η vs. Atomic Number, Z)
- •SEM Image Contrast with BSE: “Atomic Number Contrast”
- •SEM Image Contrast: “BSE Topographic Contrast—Number Effects”
- •2.2.3 Angular Distribution of Backscattering
- •Beam Incident at an Acute Angle to the Specimen Surface (Specimen Tilt > 0°)
- •SEM Image Contrast: “BSE Topographic Contrast—Trajectory Effects”
- •2.2.4 Spatial Distribution of Backscattering
- •Depth Distribution of Backscattering
- •Radial Distribution of Backscattered Electrons
- •2.3 Summary
- •References
- •3: Secondary Electrons
- •3.1 Origin
- •3.2 Energy Distribution
- •3.3 Escape Depth of Secondary Electrons
- •3.8 Spatial Characteristics of Secondary Electrons
- •References
- •4: X-Rays
- •4.1 Overview
- •4.2 Characteristic X-Rays
- •4.2.1 Origin
- •4.2.2 Fluorescence Yield
- •4.2.3 X-Ray Families
- •4.2.4 X-Ray Nomenclature
- •4.2.6 Characteristic X-Ray Intensity
- •Isolated Atoms
- •X-Ray Production in Thin Foils
- •X-Ray Intensity Emitted from Thick, Solid Specimens
- •4.3 X-Ray Continuum (bremsstrahlung)
- •4.3.1 X-Ray Continuum Intensity
- •4.3.3 Range of X-ray Production
- •4.4 X-Ray Absorption
- •4.5 X-Ray Fluorescence
- •References
- •5.1 Electron Beam Parameters
- •5.2 Electron Optical Parameters
- •5.2.1 Beam Energy
- •Landing Energy
- •5.2.2 Beam Diameter
- •5.2.3 Beam Current
- •5.2.4 Beam Current Density
- •5.2.5 Beam Convergence Angle, α
- •5.2.6 Beam Solid Angle
- •5.2.7 Electron Optical Brightness, β
- •Brightness Equation
- •5.2.8 Focus
- •Astigmatism
- •5.3 SEM Imaging Modes
- •5.3.1 High Depth-of-Field Mode
- •5.3.2 High-Current Mode
- •5.3.3 Resolution Mode
- •5.3.4 Low-Voltage Mode
- •5.4 Electron Detectors
- •5.4.1 Important Properties of BSE and SE for Detector Design and Operation
- •Abundance
- •Angular Distribution
- •Kinetic Energy Response
- •5.4.2 Detector Characteristics
- •Angular Measures for Electron Detectors
- •Elevation (Take-Off) Angle, ψ, and Azimuthal Angle, ζ
- •Solid Angle, Ω
- •Energy Response
- •Bandwidth
- •5.4.3 Common Types of Electron Detectors
- •Backscattered Electrons
- •Passive Detectors
- •Scintillation Detectors
- •Semiconductor BSE Detectors
- •5.4.4 Secondary Electron Detectors
- •Everhart–Thornley Detector
- •Through-the-Lens (TTL) Electron Detectors
- •TTL SE Detector
- •TTL BSE Detector
- •Measuring the DQE: BSE Semiconductor Detector
- •References
- •6: Image Formation
- •6.1 Image Construction by Scanning Action
- •6.2 Magnification
- •6.3 Making Dimensional Measurements With the SEM: How Big Is That Feature?
- •Using a Calibrated Structure in ImageJ-Fiji
- •6.4 Image Defects
- •6.4.1 Projection Distortion (Foreshortening)
- •6.4.2 Image Defocusing (Blurring)
- •6.5 Making Measurements on Surfaces With Arbitrary Topography: Stereomicroscopy
- •6.5.1 Qualitative Stereomicroscopy
- •Fixed beam, Specimen Position Altered
- •Fixed Specimen, Beam Incidence Angle Changed
- •6.5.2 Quantitative Stereomicroscopy
- •Measuring a Simple Vertical Displacement
- •References
- •7: SEM Image Interpretation
- •7.1 Information in SEM Images
- •7.2.2 Calculating Atomic Number Contrast
- •Establishing a Robust Light-Optical Analogy
- •Getting It Wrong: Breaking the Light-Optical Analogy of the Everhart–Thornley (Positive Bias) Detector
- •Deconstructing the SEM/E–T Image of Topography
- •SUM Mode (A + B)
- •DIFFERENCE Mode (A−B)
- •References
- •References
- •9: Image Defects
- •9.1 Charging
- •9.1.1 What Is Specimen Charging?
- •9.1.3 Techniques to Control Charging Artifacts (High Vacuum Instruments)
- •Observing Uncoated Specimens
- •Coating an Insulating Specimen for Charge Dissipation
- •Choosing the Coating for Imaging Morphology
- •9.2 Radiation Damage
- •9.3 Contamination
- •References
- •10: High Resolution Imaging
- •10.2 Instrumentation Considerations
- •10.4.1 SE Range Effects Produce Bright Edges (Isolated Edges)
- •10.4.4 Too Much of a Good Thing: The Bright Edge Effect Hinders Locating the True Position of an Edge for Critical Dimension Metrology
- •10.5.1 Beam Energy Strategies
- •Low Beam Energy Strategy
- •High Beam Energy Strategy
- •Making More SE1: Apply a Thin High-δ Metal Coating
- •Making Fewer BSEs, SE2, and SE3 by Eliminating Bulk Scattering From the Substrate
- •10.6 Factors That Hinder Achieving High Resolution
- •10.6.2 Pathological Specimen Behavior
- •Contamination
- •Instabilities
- •References
- •11: Low Beam Energy SEM
- •11.3 Selecting the Beam Energy to Control the Spatial Sampling of Imaging Signals
- •11.3.1 Low Beam Energy for High Lateral Resolution SEM
- •11.3.2 Low Beam Energy for High Depth Resolution SEM
- •11.3.3 Extremely Low Beam Energy Imaging
- •References
- •12.1.1 Stable Electron Source Operation
- •12.1.2 Maintaining Beam Integrity
- •12.1.4 Minimizing Contamination
- •12.3.1 Control of Specimen Charging
- •12.5 VPSEM Image Resolution
- •References
- •13: ImageJ and Fiji
- •13.1 The ImageJ Universe
- •13.2 Fiji
- •13.3 Plugins
- •13.4 Where to Learn More
- •References
- •14: SEM Imaging Checklist
- •14.1.1 Conducting or Semiconducting Specimens
- •14.1.2 Insulating Specimens
- •14.2 Electron Signals Available
- •14.2.1 Beam Electron Range
- •14.2.2 Backscattered Electrons
- •14.2.3 Secondary Electrons
- •14.3 Selecting the Electron Detector
- •14.3.2 Backscattered Electron Detectors
- •14.3.3 “Through-the-Lens” Detectors
- •14.4 Selecting the Beam Energy for SEM Imaging
- •14.4.4 High Resolution SEM Imaging
- •Strategy 1
- •Strategy 2
- •14.5 Selecting the Beam Current
- •14.5.1 High Resolution Imaging
- •14.5.2 Low Contrast Features Require High Beam Current and/or Long Frame Time to Establish Visibility
- •14.6 Image Presentation
- •14.6.1 “Live” Display Adjustments
- •14.6.2 Post-Collection Processing
- •14.7 Image Interpretation
- •14.7.1 Observer’s Point of View
- •14.7.3 Contrast Encoding
- •14.8.1 VPSEM Advantages
- •14.8.2 VPSEM Disadvantages
- •15: SEM Case Studies
- •15.1 Case Study: How High Is That Feature Relative to Another?
- •15.2 Revealing Shallow Surface Relief
- •16.1.2 Minor Artifacts: The Si-Escape Peak
- •16.1.3 Minor Artifacts: Coincidence Peaks
- •16.1.4 Minor Artifacts: Si Absorption Edge and Si Internal Fluorescence Peak
- •16.2 “Best Practices” for Electron-Excited EDS Operation
- •16.2.1 Operation of the EDS System
- •Choosing the EDS Time Constant (Resolution and Throughput)
- •Choosing the Solid Angle of the EDS
- •Selecting a Beam Current for an Acceptable Level of System Dead-Time
- •16.3.1 Detector Geometry
- •16.3.2 Process Time
- •16.3.3 Optimal Working Distance
- •16.3.4 Detector Orientation
- •16.3.5 Count Rate Linearity
- •16.3.6 Energy Calibration Linearity
- •16.3.7 Other Items
- •16.3.8 Setting Up a Quality Control Program
- •Using the QC Tools Within DTSA-II
- •Creating a QC Project
- •Linearity of Output Count Rate with Live-Time Dose
- •Resolution and Peak Position Stability with Count Rate
- •Solid Angle for Low X-ray Flux
- •Maximizing Throughput at Moderate Resolution
- •References
- •17: DTSA-II EDS Software
- •17.1 Getting Started With NIST DTSA-II
- •17.1.1 Motivation
- •17.1.2 Platform
- •17.1.3 Overview
- •17.1.4 Design
- •Simulation
- •Quantification
- •Experiment Design
- •Modeled Detectors (. Fig. 17.1)
- •Window Type (. Fig. 17.2)
- •The Optimal Working Distance (. Figs. 17.3 and 17.4)
- •Elevation Angle
- •Sample-to-Detector Distance
- •Detector Area
- •Crystal Thickness
- •Number of Channels, Energy Scale, and Zero Offset
- •Resolution at Mn Kα (Approximate)
- •Azimuthal Angle
- •Gold Layer, Aluminum Layer, Nickel Layer
- •Dead Layer
- •Zero Strobe Discriminator (. Figs. 17.7 and 17.8)
- •Material Editor Dialog (. Figs. 17.9, 17.10, 17.11, 17.12, 17.13, and 17.14)
- •17.2.1 Introduction
- •17.2.2 Monte Carlo Simulation
- •17.2.4 Optional Tables
- •References
- •18: Qualitative Elemental Analysis by Energy Dispersive X-Ray Spectrometry
- •18.1 Quality Assurance Issues for Qualitative Analysis: EDS Calibration
- •18.2 Principles of Qualitative EDS Analysis
- •Exciting Characteristic X-Rays
- •Fluorescence Yield
- •X-ray Absorption
- •Si Escape Peak
- •Coincidence Peaks
- •18.3 Performing Manual Qualitative Analysis
- •Beam Energy
- •Choosing the EDS Resolution (Detector Time Constant)
- •Obtaining Adequate Counts
- •18.4.1 Employ the Available Software Tools
- •18.4.3 Lower Photon Energy Region
- •18.4.5 Checking Your Work
- •18.5 A Worked Example of Manual Peak Identification
- •References
- •19.1 What Is a k-ratio?
- •19.3 Sets of k-ratios
- •19.5 The Analytical Total
- •19.6 Normalization
- •19.7.1 Oxygen by Assumed Stoichiometry
- •19.7.3 Element by Difference
- •19.8 Ways of Reporting Composition
- •19.8.1 Mass Fraction
- •19.8.2 Atomic Fraction
- •19.8.3 Stoichiometry
- •19.8.4 Oxide Fractions
- •Example Calculations
- •19.9 The Accuracy of Quantitative Electron-Excited X-ray Microanalysis
- •19.9.1 Standards-Based k-ratio Protocol
- •19.9.2 “Standardless Analysis”
- •19.10 Appendix
- •19.10.1 The Need for Matrix Corrections To Achieve Quantitative Analysis
- •19.10.2 The Physical Origin of Matrix Effects
- •19.10.3 ZAF Factors in Microanalysis
- •X-ray Generation With Depth, φ(ρz)
- •X-ray Absorption Effect, A
- •X-ray Fluorescence, F
- •References
- •20.2 Instrumentation Requirements
- •20.2.1 Choosing the EDS Parameters
- •EDS Spectrum Channel Energy Width and Spectrum Energy Span
- •EDS Time Constant (Resolution and Throughput)
- •EDS Calibration
- •EDS Solid Angle
- •20.2.2 Choosing the Beam Energy, E0
- •20.2.3 Measuring the Beam Current
- •20.2.4 Choosing the Beam Current
- •Optimizing Analysis Strategy
- •20.3.4 Ba-Ti Interference in BaTiSi3O9
- •20.4 The Need for an Iterative Qualitative and Quantitative Analysis Strategy
- •20.4.2 Analysis of a Stainless Steel
- •20.5 Is the Specimen Homogeneous?
- •20.6 Beam-Sensitive Specimens
- •20.6.1 Alkali Element Migration
- •20.6.2 Materials Subject to Mass Loss During Electron Bombardment—the Marshall-Hall Method
- •Thin Section Analysis
- •Bulk Biological and Organic Specimens
- •References
- •21: Trace Analysis by SEM/EDS
- •21.1 Limits of Detection for SEM/EDS Microanalysis
- •21.2.1 Estimating CDL from a Trace or Minor Constituent from Measuring a Known Standard
- •21.2.2 Estimating CDL After Determination of a Minor or Trace Constituent with Severe Peak Interference from a Major Constituent
- •21.3 Measurements of Trace Constituents by Electron-Excited Energy Dispersive X-ray Spectrometry
- •The Inevitable Physics of Remote Excitation Within the Specimen: Secondary Fluorescence Beyond the Electron Interaction Volume
- •Simulation of Long-Range Secondary X-ray Fluorescence
- •NIST DTSA II Simulation: Vertical Interface Between Two Regions of Different Composition in a Flat Bulk Target
- •NIST DTSA II Simulation: Cubic Particle Embedded in a Bulk Matrix
- •21.5 Summary
- •References
- •22.1.2 Low Beam Energy Analysis Range
- •22.2 Advantage of Low Beam Energy X-Ray Microanalysis
- •22.2.1 Improved Spatial Resolution
- •22.3 Challenges and Limitations of Low Beam Energy X-Ray Microanalysis
- •22.3.1 Reduced Access to Elements
- •22.3.3 At Low Beam Energy, Almost Everything Is Found To Be Layered
- •Analysis of Surface Contamination
- •References
- •23: Analysis of Specimens with Special Geometry: Irregular Bulk Objects and Particles
- •23.2.1 No Chemical Etching
- •23.3 Consequences of Attempting Analysis of Bulk Materials With Rough Surfaces
- •23.4.1 The Raw Analytical Total
- •23.4.2 The Shape of the EDS Spectrum
- •23.5 Best Practices for Analysis of Rough Bulk Samples
- •23.6 Particle Analysis
- •Particle Sample Preparation: Bulk Substrate
- •The Importance of Beam Placement
- •Overscanning
- •“Particle Mass Effect”
- •“Particle Absorption Effect”
- •The Analytical Total Reveals the Impact of Particle Effects
- •Does Overscanning Help?
- •23.6.6 Peak-to-Background (P/B) Method
- •Specimen Geometry Severely Affects the k-ratio, but Not the P/B
- •Using the P/B Correspondence
- •23.7 Summary
- •References
- •24: Compositional Mapping
- •24.2 X-Ray Spectrum Imaging
- •24.2.1 Utilizing XSI Datacubes
- •24.2.2 Derived Spectra
- •SUM Spectrum
- •MAXIMUM PIXEL Spectrum
- •24.3 Quantitative Compositional Mapping
- •24.4 Strategy for XSI Elemental Mapping Data Collection
- •24.4.1 Choosing the EDS Dead-Time
- •24.4.2 Choosing the Pixel Density
- •24.4.3 Choosing the Pixel Dwell Time
- •“Flash Mapping”
- •High Count Mapping
- •References
- •25.1 Gas Scattering Effects in the VPSEM
- •25.1.1 Why Doesn’t the EDS Collimator Exclude the Remote Skirt X-Rays?
- •25.2 What Can Be Done To Minimize gas Scattering in VPSEM?
- •25.2.2 Favorable Sample Characteristics
- •Particle Analysis
- •25.2.3 Unfavorable Sample Characteristics
- •References
- •26.1 Instrumentation
- •26.1.2 EDS Detector
- •26.1.3 Probe Current Measurement Device
- •Direct Measurement: Using a Faraday Cup and Picoammeter
- •A Faraday Cup
- •Electrically Isolated Stage
- •Indirect Measurement: Using a Calibration Spectrum
- •26.1.4 Conductive Coating
- •26.2 Sample Preparation
- •26.2.1 Standard Materials
- •26.2.2 Peak Reference Materials
- •26.3 Initial Set-Up
- •26.3.1 Calibrating the EDS Detector
- •Selecting a Pulse Process Time Constant
- •Energy Calibration
- •Quality Control
- •Sample Orientation
- •Detector Position
- •Probe Current
- •26.4 Collecting Data
- •26.4.1 Exploratory Spectrum
- •26.4.2 Experiment Optimization
- •26.4.3 Selecting Standards
- •26.4.4 Reference Spectra
- •26.4.5 Collecting Standards
- •26.4.6 Collecting Peak-Fitting References
- •26.5 Data Analysis
- •26.5.2 Quantification
- •26.6 Quality Check
- •Reference
- •27.2 Case Study: Aluminum Wire Failures in Residential Wiring
- •References
- •28: Cathodoluminescence
- •28.1 Origin
- •28.2 Measuring Cathodoluminescence
- •28.3 Applications of CL
- •28.3.1 Geology
- •Carbonado Diamond
- •Ancient Impact Zircons
- •28.3.2 Materials Science
- •Semiconductors
- •Lead-Acid Battery Plate Reactions
- •28.3.3 Organic Compounds
- •References
- •29.1.1 Single Crystals
- •29.1.2 Polycrystalline Materials
- •29.1.3 Conditions for Detecting Electron Channeling Contrast
- •Specimen Preparation
- •Instrument Conditions
- •29.2.1 Origin of EBSD Patterns
- •29.2.2 Cameras for EBSD Pattern Detection
- •29.2.3 EBSD Spatial Resolution
- •29.2.5 Steps in Typical EBSD Measurements
- •Sample Preparation for EBSD
- •Align Sample in the SEM
- •Check for EBSD Patterns
- •Adjust SEM and Select EBSD Map Parameters
- •Run the Automated Map
- •29.2.6 Display of the Acquired Data
- •29.2.7 Other Map Components
- •29.2.10 Application Example
- •Application of EBSD To Understand Meteorite Formation
- •29.2.11 Summary
- •Specimen Considerations
- •EBSD Detector
- •Selection of Candidate Crystallographic Phases
- •Microscope Operating Conditions and Pattern Optimization
- •Selection of EBSD Acquisition Parameters
- •Collect the Orientation Map
- •References
- •30.1 Introduction
- •30.2 Ion–Solid Interactions
- •30.3 Focused Ion Beam Systems
- •30.5 Preparation of Samples for SEM
- •30.5.1 Cross-Section Preparation
- •30.5.2 FIB Sample Preparation for 3D Techniques and Imaging
- •30.6 Summary
- •References
- •31: Ion Beam Microscopy
- •31.1 What Is So Useful About Ions?
- •31.2 Generating Ion Beams
- •31.3 Signal Generation in the HIM
- •31.5 Patterning with Ion Beams
- •31.7 Chemical Microanalysis with Ion Beams
- •References
- •Appendix
- •A Database of Electron–Solid Interactions
- •A Database of Electron–Solid Interactions
- •Introduction
- •Backscattered Electrons
- •Secondary Yields
- •Stopping Powers
- •X-ray Ionization Cross Sections
- •Conclusions
- •References
- •Index
- •Reference List
- •Index
\236 Chapter 17 · DTSA-II EDS Software
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17.1\ Getting Started With NIST DTSA-II |
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17.1.1\ |
Motivation |
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Reading about a new subject is good but there is nothing like |
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doing to reinforce understanding. With this in mind, the |
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authors of this textbook have designed a number of practical |
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exercises that reinforce the book’s subject matter. Some of |
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these exercises can be performed with software you have |
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available to you—either instrument vendor software or a |
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spreadsheet like MS Excel or LibreOffice/OpenOffice Calc. |
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Other exercises require functionality which may not be pres- |
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ent in all instrument vendor’s software. Regardless, it is much |
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easier to explain an exercise when everyone is working with |
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the same tools. |
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To ensure that everyone has the tools necessary to perform |
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the exercises, we have developed the National Institute of |
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Standards and Technology software called DTSA-II (Ritchie, |
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2009, 2010, 2011a, b, c, 2012, 2017a, b). NIST DTSA-II is |
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quantitative X-ray microanalysis software designed with edu- |
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cation and best practices in mind. Furthermore, as an output |
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of the US Federal Government, it is not subject to copyright |
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restrictions and freely available to all regardless of affiliation |
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or nationality. From a practical perspective, this means that |
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you can install and use DTSA-II on any suitable computer. |
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You can give it to colleagues or students. You can use it at |
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home, in your office, or in the lab. If you are so inclined, the |
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source code is available to allow you to review the implemen- |
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tation or to enhance the tool for your own special purposes. |
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Exercises in the textbook will be designed around the |
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capabilities of DTSA-II. Many will take advantage of the |
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graphical user interface to manipulate and interrogate spec- |
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tra. A number will take advantage of the command line |
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scripting interface to access low-level data or to perform |
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advanced operations. |
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17.1.2\ |
Platform |
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NIST DTSA-II is written in the multi-platform run-time environment Java. This means that the same program runs on Microsoft Windows (XP, Vista, 7, 8.X, 10.X), Apple OS X 10.6+, and many flavors of Linux and UNIX. The run-time environment adjusts the look-and-feel of the application to be consistent with the standards for each operating system. For Windows, Linux, and UNIX, the main menu is part of the main application window. In OS X, the main menu is at the top of the primary screen.
To make installation as easy as possible on each environment, an installer has been developed which works on Windows, OS X, and Linux/UNIX. The installer verifies that an appropriate version of Java is available and place the executable and data files in a location that is consistent with operating system guidelines. Detailed installation instructions are available on the download site.
17.1.3\ Overview
DTSA-II was designed around common user interface metaphors and should feel consistent with other programs on your operating system. It has a main menu which provides a handful of high-level interactions such as file access, processing, simulation, reporting, and help. Many of these menu items lead to “wizard-style” dialogs which take you step-by- step through some more complex operation like experiment design, spectrum quantification, or spectrum simulation. The goal is to make common operations as simple as possible.
Additional tools are often available through context sensitive menus. Each region on the DTSA-II main window provides different functionality. Within these regions, you are likely to want to perform various context sensitive operations. These operations are accesses through menus that are accessed by placing the mouse over the region and issuing a
“right-button click” on Windows/Linux/UNIX or an AppleCommand key + mouse click on OS X. The context-sensitive menu items may perform operations immediately, or they may request additional information through dialog boxes.
On the main screen, the bottom half of window is three tabs—the Spectrum tab, the Report tab, and the Command tab. The spectrum tab is useful for investigating and manipulating spectra. The report tab provides a record of the work completed during this invocation of the program. Since the report is in HTML (Hypertext Markup Language) and stored by date, it is possible to review old reports either in DTSA-II or in a standard web browser. Some operating systems will index HTML documents making it easy to find old designs, analyses or simulations.
The final tab contains a command line interface. The command line interface implements a Python syntax scripting environment. Python is a popular, powerful and complete scripting language. Through Python it is possible (though not necessarily easy) to perform anything that can be done through the GUI. It is also possible to do a lot more. For example, the GUI makes available some common, useful geometries for performing Monte Carlo simulations of spectrum generation. Through scripting, it is possible to simulate arbitrary sample and detector geometries. Some of the examples in the text will involve scripting. These scripts will be installed with the software so they are readily available and so you can use these as the basis for your own custom scripts.
An important foundational concept in DTSA-II is the definition of an X-ray detector. The software comes with a “default detector” which represents a typical Si(Li) detector on a typical SEM. This detector will produce adequate results for many purposes. However, it is better and more useful if you create your own detector definition or definitions to reflect the design and performance of your detector(s) and SEM. You define your own detector using the “Preferences” dialog which is access through the “File →Preferences” main menu item. To select and activate your detector, you select it in the “Default Detector” drop down lists on the middle, left side of the main DTSA-II window on the “Spectrum Tab.”
17.1 · Getting Started With NIST DTSA-II
17.1.4\ Design
DTSA-II is, in many ways, much more like vendor software used to be. This has advantages and disadvantages. Over the years, vendors have simplified their software. They have removed many more advanced spectrum manipulation tools and they have streamlined their software to make getting an answer as straightforward as possible. If your goal is simply to collect a spectrum, press a button, and report a result, the vendor software is ideal. However, if you want to develop a more deep understanding of how spectrum analysis works, many vendors have buried the tools or removed them entirely. DTSA-II retains many of the advanced spectrum manipulation and interrogation tools.
DTSA-II is designed with Einstein’s suggestion about simplicity in mind: “Everything should be made as simple as possible, but not simpler.” DTSA-II was designed with the goal of making the most reliable and accurate means of quantification, standards-based quantification, as simple as possible, but not simpler. When there is a choice that might compromise reliability or accuracy for simplicity, reliability and accuracy wins out.
One such example is “auto-quant.” Most microanalysis software will automatically place peak markers on spectra. Unfortunately, these markers have time and time again been demonstrated to be reliable in many but far from all cases. Users grow dependent on auto-quant and when it fails they often don’t have the experience or confidence to identify the failures. The consequence is that the qualitative and then since the qualitative results are used to produce quantitative results, the quantitative results are just plain wrong.
Rather than risking being wrong, DTSA-II requires the user to perform manual peak identification. The process is more tedious and requires more understanding by the user. But no more understanding than is necessary to judge whether the vendor’s auto-qual has worked correctly. If you as a user can’t perform manual qualitative analysis reliably, you should not be using the vendor’s auto-qual.
17.1.5\ The Three -Leg Stool: Simulation,
Quantification and Experiment
Design
NIST DTSA-II is designed to tie together three tools which are integral to the process of performing high-quality X-ray microanalysis—simulation, quantification, and experiment design. Simulation allows you to understand the measurement process for both simple measurements and more complex materials and geometries. Quantification allows you to turn spectra into estimates of composition. Experiment design ties together simulation and quantification to allow you to develop the most accurate and reliable measurement protocols.
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Simulation
Spectrum generation can be modeled either using analytical models or using Monte Carlo models. The difference is that analytical models are deterministic, they always produce the same output for the equivalent input, and they are less computationally intensive. They are limited, however, in the geometries for which we know how to perform the analytical calculation. Monte Carlo models are based on pseudo- random simulation of the physics of electron interactions and X-ray production. Individual electron trajectories are traced as they meander through the sample. Interactions like elastic scattering off the electrons and nucleus in the sample are modeled. Inelastic interactions like core-shell ionization are also modeled. Each core shell ionization is followed by either an Auger electron or an X-ray photon. The trajectories of these can also be modeled. The resulting X-rays can be collected in a modeled detector and the result presented as a dose-correct spectrum.
So, in summary, analytical models are quicker, but Montel Carlo models are more flexible. Regardless, in domains where they are both applicable, they produce similar but not identical results.
Quantification
Accurate, reliable quantification is the goal. Turning measured spectra into reliable estimates of material composition can be a challenge. Our techniques work well when we are careful to prepare our samples, collect our spectra, and process the data. However, there are many pitfalls and potential sources of error for the novice or the overconfident.
DTSA-II implements some of the most reliable algorithms for spectrum quantification. First, DTSA-II assumes that you will be comparing your unknown spectrum to spectra collected from standard materials. Standards-based quantification is the most accurate and reliable technique known. Second, DTSA-II implements robust algorithms for comparing peak intensities between standards and unknown. DTSA-II uses linear least squares fitting of background filtered spectra. This algorithm is robust, accurate, and makes very good use of the all the information present in each peak. It also provides mechanism called the residual to determine whether the correct elements have been identified and fit.
Fitting produces k-ratios which are the first-order estimates of composition. To extract the true composition, the k-ratios must be scaled to account for differences in absorption, atomic number, and secondary fluorescence. DTSA-II implements a handful of different matrix correction algorithms although users are encouraged to use the default algorithm (‘XPP’ by Pouchou and Pichoir, 1991) unless they have a compelling reason to do otherwise.
Experiment Design
One thing that has long hindered people from performing standards-based quantification is the complexity of designing an optimal standards-based measurement. The choices