- •Preface
- •Imaging Microscopic Features
- •Measuring the Crystal Structure
- •References
- •Contents
- •1.4 Simulating the Effects of Elastic Scattering: Monte Carlo Calculations
- •What Are the Main Features of the Beam Electron Interaction Volume?
- •How Does the Interaction Volume Change with Composition?
- •How Does the Interaction Volume Change with Incident Beam Energy?
- •How Does the Interaction Volume Change with Specimen Tilt?
- •1.5 A Range Equation To Estimate the Size of the Interaction Volume
- •References
- •2: Backscattered Electrons
- •2.1 Origin
- •2.2.1 BSE Response to Specimen Composition (η vs. Atomic Number, Z)
- •SEM Image Contrast with BSE: “Atomic Number Contrast”
- •SEM Image Contrast: “BSE Topographic Contrast—Number Effects”
- •2.2.3 Angular Distribution of Backscattering
- •Beam Incident at an Acute Angle to the Specimen Surface (Specimen Tilt > 0°)
- •SEM Image Contrast: “BSE Topographic Contrast—Trajectory Effects”
- •2.2.4 Spatial Distribution of Backscattering
- •Depth Distribution of Backscattering
- •Radial Distribution of Backscattered Electrons
- •2.3 Summary
- •References
- •3: Secondary Electrons
- •3.1 Origin
- •3.2 Energy Distribution
- •3.3 Escape Depth of Secondary Electrons
- •3.8 Spatial Characteristics of Secondary Electrons
- •References
- •4: X-Rays
- •4.1 Overview
- •4.2 Characteristic X-Rays
- •4.2.1 Origin
- •4.2.2 Fluorescence Yield
- •4.2.3 X-Ray Families
- •4.2.4 X-Ray Nomenclature
- •4.2.6 Characteristic X-Ray Intensity
- •Isolated Atoms
- •X-Ray Production in Thin Foils
- •X-Ray Intensity Emitted from Thick, Solid Specimens
- •4.3 X-Ray Continuum (bremsstrahlung)
- •4.3.1 X-Ray Continuum Intensity
- •4.3.3 Range of X-ray Production
- •4.4 X-Ray Absorption
- •4.5 X-Ray Fluorescence
- •References
- •5.1 Electron Beam Parameters
- •5.2 Electron Optical Parameters
- •5.2.1 Beam Energy
- •Landing Energy
- •5.2.2 Beam Diameter
- •5.2.3 Beam Current
- •5.2.4 Beam Current Density
- •5.2.5 Beam Convergence Angle, α
- •5.2.6 Beam Solid Angle
- •5.2.7 Electron Optical Brightness, β
- •Brightness Equation
- •5.2.8 Focus
- •Astigmatism
- •5.3 SEM Imaging Modes
- •5.3.1 High Depth-of-Field Mode
- •5.3.2 High-Current Mode
- •5.3.3 Resolution Mode
- •5.3.4 Low-Voltage Mode
- •5.4 Electron Detectors
- •5.4.1 Important Properties of BSE and SE for Detector Design and Operation
- •Abundance
- •Angular Distribution
- •Kinetic Energy Response
- •5.4.2 Detector Characteristics
- •Angular Measures for Electron Detectors
- •Elevation (Take-Off) Angle, ψ, and Azimuthal Angle, ζ
- •Solid Angle, Ω
- •Energy Response
- •Bandwidth
- •5.4.3 Common Types of Electron Detectors
- •Backscattered Electrons
- •Passive Detectors
- •Scintillation Detectors
- •Semiconductor BSE Detectors
- •5.4.4 Secondary Electron Detectors
- •Everhart–Thornley Detector
- •Through-the-Lens (TTL) Electron Detectors
- •TTL SE Detector
- •TTL BSE Detector
- •Measuring the DQE: BSE Semiconductor Detector
- •References
- •6: Image Formation
- •6.1 Image Construction by Scanning Action
- •6.2 Magnification
- •6.3 Making Dimensional Measurements With the SEM: How Big Is That Feature?
- •Using a Calibrated Structure in ImageJ-Fiji
- •6.4 Image Defects
- •6.4.1 Projection Distortion (Foreshortening)
- •6.4.2 Image Defocusing (Blurring)
- •6.5 Making Measurements on Surfaces With Arbitrary Topography: Stereomicroscopy
- •6.5.1 Qualitative Stereomicroscopy
- •Fixed beam, Specimen Position Altered
- •Fixed Specimen, Beam Incidence Angle Changed
- •6.5.2 Quantitative Stereomicroscopy
- •Measuring a Simple Vertical Displacement
- •References
- •7: SEM Image Interpretation
- •7.1 Information in SEM Images
- •7.2.2 Calculating Atomic Number Contrast
- •Establishing a Robust Light-Optical Analogy
- •Getting It Wrong: Breaking the Light-Optical Analogy of the Everhart–Thornley (Positive Bias) Detector
- •Deconstructing the SEM/E–T Image of Topography
- •SUM Mode (A + B)
- •DIFFERENCE Mode (A−B)
- •References
- •References
- •9: Image Defects
- •9.1 Charging
- •9.1.1 What Is Specimen Charging?
- •9.1.3 Techniques to Control Charging Artifacts (High Vacuum Instruments)
- •Observing Uncoated Specimens
- •Coating an Insulating Specimen for Charge Dissipation
- •Choosing the Coating for Imaging Morphology
- •9.2 Radiation Damage
- •9.3 Contamination
- •References
- •10: High Resolution Imaging
- •10.2 Instrumentation Considerations
- •10.4.1 SE Range Effects Produce Bright Edges (Isolated Edges)
- •10.4.4 Too Much of a Good Thing: The Bright Edge Effect Hinders Locating the True Position of an Edge for Critical Dimension Metrology
- •10.5.1 Beam Energy Strategies
- •Low Beam Energy Strategy
- •High Beam Energy Strategy
- •Making More SE1: Apply a Thin High-δ Metal Coating
- •Making Fewer BSEs, SE2, and SE3 by Eliminating Bulk Scattering From the Substrate
- •10.6 Factors That Hinder Achieving High Resolution
- •10.6.2 Pathological Specimen Behavior
- •Contamination
- •Instabilities
- •References
- •11: Low Beam Energy SEM
- •11.3 Selecting the Beam Energy to Control the Spatial Sampling of Imaging Signals
- •11.3.1 Low Beam Energy for High Lateral Resolution SEM
- •11.3.2 Low Beam Energy for High Depth Resolution SEM
- •11.3.3 Extremely Low Beam Energy Imaging
- •References
- •12.1.1 Stable Electron Source Operation
- •12.1.2 Maintaining Beam Integrity
- •12.1.4 Minimizing Contamination
- •12.3.1 Control of Specimen Charging
- •12.5 VPSEM Image Resolution
- •References
- •13: ImageJ and Fiji
- •13.1 The ImageJ Universe
- •13.2 Fiji
- •13.3 Plugins
- •13.4 Where to Learn More
- •References
- •14: SEM Imaging Checklist
- •14.1.1 Conducting or Semiconducting Specimens
- •14.1.2 Insulating Specimens
- •14.2 Electron Signals Available
- •14.2.1 Beam Electron Range
- •14.2.2 Backscattered Electrons
- •14.2.3 Secondary Electrons
- •14.3 Selecting the Electron Detector
- •14.3.2 Backscattered Electron Detectors
- •14.3.3 “Through-the-Lens” Detectors
- •14.4 Selecting the Beam Energy for SEM Imaging
- •14.4.4 High Resolution SEM Imaging
- •Strategy 1
- •Strategy 2
- •14.5 Selecting the Beam Current
- •14.5.1 High Resolution Imaging
- •14.5.2 Low Contrast Features Require High Beam Current and/or Long Frame Time to Establish Visibility
- •14.6 Image Presentation
- •14.6.1 “Live” Display Adjustments
- •14.6.2 Post-Collection Processing
- •14.7 Image Interpretation
- •14.7.1 Observer’s Point of View
- •14.7.3 Contrast Encoding
- •14.8.1 VPSEM Advantages
- •14.8.2 VPSEM Disadvantages
- •15: SEM Case Studies
- •15.1 Case Study: How High Is That Feature Relative to Another?
- •15.2 Revealing Shallow Surface Relief
- •16.1.2 Minor Artifacts: The Si-Escape Peak
- •16.1.3 Minor Artifacts: Coincidence Peaks
- •16.1.4 Minor Artifacts: Si Absorption Edge and Si Internal Fluorescence Peak
- •16.2 “Best Practices” for Electron-Excited EDS Operation
- •16.2.1 Operation of the EDS System
- •Choosing the EDS Time Constant (Resolution and Throughput)
- •Choosing the Solid Angle of the EDS
- •Selecting a Beam Current for an Acceptable Level of System Dead-Time
- •16.3.1 Detector Geometry
- •16.3.2 Process Time
- •16.3.3 Optimal Working Distance
- •16.3.4 Detector Orientation
- •16.3.5 Count Rate Linearity
- •16.3.6 Energy Calibration Linearity
- •16.3.7 Other Items
- •16.3.8 Setting Up a Quality Control Program
- •Using the QC Tools Within DTSA-II
- •Creating a QC Project
- •Linearity of Output Count Rate with Live-Time Dose
- •Resolution and Peak Position Stability with Count Rate
- •Solid Angle for Low X-ray Flux
- •Maximizing Throughput at Moderate Resolution
- •References
- •17: DTSA-II EDS Software
- •17.1 Getting Started With NIST DTSA-II
- •17.1.1 Motivation
- •17.1.2 Platform
- •17.1.3 Overview
- •17.1.4 Design
- •Simulation
- •Quantification
- •Experiment Design
- •Modeled Detectors (. Fig. 17.1)
- •Window Type (. Fig. 17.2)
- •The Optimal Working Distance (. Figs. 17.3 and 17.4)
- •Elevation Angle
- •Sample-to-Detector Distance
- •Detector Area
- •Crystal Thickness
- •Number of Channels, Energy Scale, and Zero Offset
- •Resolution at Mn Kα (Approximate)
- •Azimuthal Angle
- •Gold Layer, Aluminum Layer, Nickel Layer
- •Dead Layer
- •Zero Strobe Discriminator (. Figs. 17.7 and 17.8)
- •Material Editor Dialog (. Figs. 17.9, 17.10, 17.11, 17.12, 17.13, and 17.14)
- •17.2.1 Introduction
- •17.2.2 Monte Carlo Simulation
- •17.2.4 Optional Tables
- •References
- •18: Qualitative Elemental Analysis by Energy Dispersive X-Ray Spectrometry
- •18.1 Quality Assurance Issues for Qualitative Analysis: EDS Calibration
- •18.2 Principles of Qualitative EDS Analysis
- •Exciting Characteristic X-Rays
- •Fluorescence Yield
- •X-ray Absorption
- •Si Escape Peak
- •Coincidence Peaks
- •18.3 Performing Manual Qualitative Analysis
- •Beam Energy
- •Choosing the EDS Resolution (Detector Time Constant)
- •Obtaining Adequate Counts
- •18.4.1 Employ the Available Software Tools
- •18.4.3 Lower Photon Energy Region
- •18.4.5 Checking Your Work
- •18.5 A Worked Example of Manual Peak Identification
- •References
- •19.1 What Is a k-ratio?
- •19.3 Sets of k-ratios
- •19.5 The Analytical Total
- •19.6 Normalization
- •19.7.1 Oxygen by Assumed Stoichiometry
- •19.7.3 Element by Difference
- •19.8 Ways of Reporting Composition
- •19.8.1 Mass Fraction
- •19.8.2 Atomic Fraction
- •19.8.3 Stoichiometry
- •19.8.4 Oxide Fractions
- •Example Calculations
- •19.9 The Accuracy of Quantitative Electron-Excited X-ray Microanalysis
- •19.9.1 Standards-Based k-ratio Protocol
- •19.9.2 “Standardless Analysis”
- •19.10 Appendix
- •19.10.1 The Need for Matrix Corrections To Achieve Quantitative Analysis
- •19.10.2 The Physical Origin of Matrix Effects
- •19.10.3 ZAF Factors in Microanalysis
- •X-ray Generation With Depth, φ(ρz)
- •X-ray Absorption Effect, A
- •X-ray Fluorescence, F
- •References
- •20.2 Instrumentation Requirements
- •20.2.1 Choosing the EDS Parameters
- •EDS Spectrum Channel Energy Width and Spectrum Energy Span
- •EDS Time Constant (Resolution and Throughput)
- •EDS Calibration
- •EDS Solid Angle
- •20.2.2 Choosing the Beam Energy, E0
- •20.2.3 Measuring the Beam Current
- •20.2.4 Choosing the Beam Current
- •Optimizing Analysis Strategy
- •20.3.4 Ba-Ti Interference in BaTiSi3O9
- •20.4 The Need for an Iterative Qualitative and Quantitative Analysis Strategy
- •20.4.2 Analysis of a Stainless Steel
- •20.5 Is the Specimen Homogeneous?
- •20.6 Beam-Sensitive Specimens
- •20.6.1 Alkali Element Migration
- •20.6.2 Materials Subject to Mass Loss During Electron Bombardment—the Marshall-Hall Method
- •Thin Section Analysis
- •Bulk Biological and Organic Specimens
- •References
- •21: Trace Analysis by SEM/EDS
- •21.1 Limits of Detection for SEM/EDS Microanalysis
- •21.2.1 Estimating CDL from a Trace or Minor Constituent from Measuring a Known Standard
- •21.2.2 Estimating CDL After Determination of a Minor or Trace Constituent with Severe Peak Interference from a Major Constituent
- •21.3 Measurements of Trace Constituents by Electron-Excited Energy Dispersive X-ray Spectrometry
- •The Inevitable Physics of Remote Excitation Within the Specimen: Secondary Fluorescence Beyond the Electron Interaction Volume
- •Simulation of Long-Range Secondary X-ray Fluorescence
- •NIST DTSA II Simulation: Vertical Interface Between Two Regions of Different Composition in a Flat Bulk Target
- •NIST DTSA II Simulation: Cubic Particle Embedded in a Bulk Matrix
- •21.5 Summary
- •References
- •22.1.2 Low Beam Energy Analysis Range
- •22.2 Advantage of Low Beam Energy X-Ray Microanalysis
- •22.2.1 Improved Spatial Resolution
- •22.3 Challenges and Limitations of Low Beam Energy X-Ray Microanalysis
- •22.3.1 Reduced Access to Elements
- •22.3.3 At Low Beam Energy, Almost Everything Is Found To Be Layered
- •Analysis of Surface Contamination
- •References
- •23: Analysis of Specimens with Special Geometry: Irregular Bulk Objects and Particles
- •23.2.1 No Chemical Etching
- •23.3 Consequences of Attempting Analysis of Bulk Materials With Rough Surfaces
- •23.4.1 The Raw Analytical Total
- •23.4.2 The Shape of the EDS Spectrum
- •23.5 Best Practices for Analysis of Rough Bulk Samples
- •23.6 Particle Analysis
- •Particle Sample Preparation: Bulk Substrate
- •The Importance of Beam Placement
- •Overscanning
- •“Particle Mass Effect”
- •“Particle Absorption Effect”
- •The Analytical Total Reveals the Impact of Particle Effects
- •Does Overscanning Help?
- •23.6.6 Peak-to-Background (P/B) Method
- •Specimen Geometry Severely Affects the k-ratio, but Not the P/B
- •Using the P/B Correspondence
- •23.7 Summary
- •References
- •24: Compositional Mapping
- •24.2 X-Ray Spectrum Imaging
- •24.2.1 Utilizing XSI Datacubes
- •24.2.2 Derived Spectra
- •SUM Spectrum
- •MAXIMUM PIXEL Spectrum
- •24.3 Quantitative Compositional Mapping
- •24.4 Strategy for XSI Elemental Mapping Data Collection
- •24.4.1 Choosing the EDS Dead-Time
- •24.4.2 Choosing the Pixel Density
- •24.4.3 Choosing the Pixel Dwell Time
- •“Flash Mapping”
- •High Count Mapping
- •References
- •25.1 Gas Scattering Effects in the VPSEM
- •25.1.1 Why Doesn’t the EDS Collimator Exclude the Remote Skirt X-Rays?
- •25.2 What Can Be Done To Minimize gas Scattering in VPSEM?
- •25.2.2 Favorable Sample Characteristics
- •Particle Analysis
- •25.2.3 Unfavorable Sample Characteristics
- •References
- •26.1 Instrumentation
- •26.1.2 EDS Detector
- •26.1.3 Probe Current Measurement Device
- •Direct Measurement: Using a Faraday Cup and Picoammeter
- •A Faraday Cup
- •Electrically Isolated Stage
- •Indirect Measurement: Using a Calibration Spectrum
- •26.1.4 Conductive Coating
- •26.2 Sample Preparation
- •26.2.1 Standard Materials
- •26.2.2 Peak Reference Materials
- •26.3 Initial Set-Up
- •26.3.1 Calibrating the EDS Detector
- •Selecting a Pulse Process Time Constant
- •Energy Calibration
- •Quality Control
- •Sample Orientation
- •Detector Position
- •Probe Current
- •26.4 Collecting Data
- •26.4.1 Exploratory Spectrum
- •26.4.2 Experiment Optimization
- •26.4.3 Selecting Standards
- •26.4.4 Reference Spectra
- •26.4.5 Collecting Standards
- •26.4.6 Collecting Peak-Fitting References
- •26.5 Data Analysis
- •26.5.2 Quantification
- •26.6 Quality Check
- •Reference
- •27.2 Case Study: Aluminum Wire Failures in Residential Wiring
- •References
- •28: Cathodoluminescence
- •28.1 Origin
- •28.2 Measuring Cathodoluminescence
- •28.3 Applications of CL
- •28.3.1 Geology
- •Carbonado Diamond
- •Ancient Impact Zircons
- •28.3.2 Materials Science
- •Semiconductors
- •Lead-Acid Battery Plate Reactions
- •28.3.3 Organic Compounds
- •References
- •29.1.1 Single Crystals
- •29.1.2 Polycrystalline Materials
- •29.1.3 Conditions for Detecting Electron Channeling Contrast
- •Specimen Preparation
- •Instrument Conditions
- •29.2.1 Origin of EBSD Patterns
- •29.2.2 Cameras for EBSD Pattern Detection
- •29.2.3 EBSD Spatial Resolution
- •29.2.5 Steps in Typical EBSD Measurements
- •Sample Preparation for EBSD
- •Align Sample in the SEM
- •Check for EBSD Patterns
- •Adjust SEM and Select EBSD Map Parameters
- •Run the Automated Map
- •29.2.6 Display of the Acquired Data
- •29.2.7 Other Map Components
- •29.2.10 Application Example
- •Application of EBSD To Understand Meteorite Formation
- •29.2.11 Summary
- •Specimen Considerations
- •EBSD Detector
- •Selection of Candidate Crystallographic Phases
- •Microscope Operating Conditions and Pattern Optimization
- •Selection of EBSD Acquisition Parameters
- •Collect the Orientation Map
- •References
- •30.1 Introduction
- •30.2 Ion–Solid Interactions
- •30.3 Focused Ion Beam Systems
- •30.5 Preparation of Samples for SEM
- •30.5.1 Cross-Section Preparation
- •30.5.2 FIB Sample Preparation for 3D Techniques and Imaging
- •30.6 Summary
- •References
- •31: Ion Beam Microscopy
- •31.1 What Is So Useful About Ions?
- •31.2 Generating Ion Beams
- •31.3 Signal Generation in the HIM
- •31.5 Patterning with Ion Beams
- •31.7 Chemical Microanalysis with Ion Beams
- •References
- •Appendix
- •A Database of Electron–Solid Interactions
- •A Database of Electron–Solid Interactions
- •Introduction
- •Backscattered Electrons
- •Secondary Yields
- •Stopping Powers
- •X-ray Ionization Cross Sections
- •Conclusions
- •References
- •Index
- •Reference List
- •Index
References
References
Currie LA (1968) Limits for qualitative detection and quantitative determination. Anal Chem 40:586
Newbury D (2005) Misidentification of major constituents by automatic qualitative energy dispersive X-ray microanalysis: a problem that threatens the credibility of the analytical community. Microsc Microanal 11:545
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Newbury D (2007) Mistakes encountered during automatic peak identification in low beam energy X-ray microanalysis. Scanning 29:137
Newbury D (2009) Mistakes encountered during automatic peak identification of minor and trace constituents in electron-excited energy dispersive X-ray microanalysis. Scanning 31:1
Statham P (1995) Quantifying Benefits of resolution and count rate in EDX microanalysis. In: Williams D, Goldstein J, Newbury D (eds) X-ray spectrometry in electron beam instruments. Plenum, New York, pp 101–126
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Quantitative Analysis:
From k-ratio to Composition
19.1\ What Is a k-ratio? – 290
19.2\ Uncertainties in k-ratios – 291
19.3\ Sets of k-ratios – 291
19.4\ Converting Sets of k-ratios Into Composition – 292 19.5\ The Analytical Total – 292
19.6\ Normalization – 292
19.7 Other Ways toEstimate CZ – 293
19.7.1\ Oxygen by Assumed Stoichiometry – 293 19.7.2\ Waters of Crystallization – 293
19.7.3\ Element by Difference – 293
19.8\ Ways of Reporting Composition – 294
19.8.1\ Mass Fraction – 294
19.8.2\ Atomic Fraction – 294
19.8.3\ Stoichiometry – 294
19.8.4\ Oxide Fractions – 294
19.9\ The Accuracy of Quantitative Electron-Excited X-ray Microanalysis – 295
19.9.1\ Standards-Based k-ratio Protocol – 295 19.9.2\ “Standardless Analysis” – 296
19.10\ Appendix – 298
19.10.1\ The Need for Matrix Corrections To Achieve Quantitative Analysis – 298
19.10.2\ The Physical Origin of Matrix Effects – 299 19.10.3\ ZAF Factors in Microanalysis – 299
\References – 307
© Springer Science+Business Media LLC 2018
J. Goldstein et al., Scanning Electron Microscopy and X-Ray Microanalysis, https://doi.org/10.1007/978-1-4939-6676-9_19
290\ Chapter 19 · Quantitative Analysis: From k-ratio to Composition
19.1\ What Is a k-ratio?
A k-ratio is the ratio of a pair of characteristic X-ray line intensities, I, measured under similar experimental conditions for the unknown (unk) and standard (std):
k =Iunk / Istd \ |
(19.1) |
The measured intensities can be associated with a single characteristic X-ray line (as is typically the case for wavelength spectrometers) or associated with a family of characteristic X-ray lines (as is typically the case for energy dispersive spectrometers.) The numerator of the k-ratio is typically the intensity measured from an unknown sample and the denominator is typically the intensity measured from a standard material—a material of known composition.
Both the numerator and the denominator of the k-ratio must be measured under similar, well-controlled instrument conditions. The electron beam energy must be the same. The probe dose, the number of electrons striking the sample during the measurement, should be the same (or the intensity scaled to equivalent dose.) The position of the sample relative to the beam and to the detector should be fixed. Both the sample and the standard(s) should be prepared to a high degree of surface polish, ideally to reduce surface relief below 50 nm, and the surface should not be chemically etched. If the unknown is non-conducting, the same thickness of conducting coating, usually carbon with a thickness below 10 nm, should be applied to both the unknown and the standard(s). Ideally, the only aspect that should differ between the measurement of the unknown and the standard are the compositions of the materials.
The k-ratio is the first estimate of material composition. From a set of k-ratios, we can estimate the unknown material composition. In many cases, to a good approximation:
CZ ,unk kZ CZ ,std = Iunk / Istd CZ ,std \ |
(19.2) |
where CZ,unk and CZ,std are the mass fraction of element Z in the unknown and standard, respectively, and kZ is the k-ratio
measured for element Z. This relationship is called “Castaing’s first approximation” after the seminal figure in X-ray microanalysis, who established the k-ratio as the basis for quantita-
19 tive analysis (Castaing 1951).
By taking a ratio of intensities collected under similar conditions, the k-ratio is independent of various pieces of poorly known information.
\1.\ The k-ratio eliminates the need to know the efficiency of the detector since both sample and unknown are measured on the same detector at the same relative position. Since the efficiency as a multiplier of the intensity is identical in the numerator and denominator of the k-ratio, the efficiency cancels quantitatively in the ratio.
\2. \ The k-ratio mitigates the need to know the physics of the X-ray generation process if the same elements are excited under essentially the same conditions. The ionization cross section, the relaxation rates, and other poorly
known physical parameters are the same for an element in the standard and the unknown.
In the history of the development of quantitative electron- excited X-ray microanalysis, the X-ray intensities for the unknown and standards were measured sequentially with a wavelength spectrometer in terms of X-ray counts. The raw measurement contains counts that can be attributed to both the continuum background (bremsstrahlung) and characteristic X-rays. Since k-ratio is a function of only the characteristic X-rays, the contribution of the continuum must be estimated. Usually, this is accomplished by measuring two off-peak measurements bounding the peak and using interpolation to estimate the intensity of the continuum background at the peak position. The estimated continuum is subtracted from the measured on peak intensity to give the characteristic X-ray line intensity.
Extracting the k-ratio with an energy dispersive spectrometer can be done in a similar manner for isolated peaks. However, to deal with the peak interferences frequently encountered in EDS spectra, it is necessary to simultaneously consider all of the spectrum channels that span the mutually interfering peaks. Through a process called linear least squares fitting, a scale factor is computed which represents the multiplicative factor by which the integrated area under the characteristic peak from the standard must be multiplied by to equal the integrated area under the characteristic peak from the unknown. This scale factor is the k-ratio, and the fitting process separates the intensity components of the interfering peaks and the continuum background. The integrated counts measured for the unknown and for the standard for element Z enable an estimate of the precision of the measurement for that element. Linear least squares fitting is employed in NIST DTSA-II to recover characteristic X-ray intensities, even in situations with extreme peak overlaps.
A measured k-ratio of zero suggests that there is none of the associated element in the unknown. A measurement on a standard with exactly the same composition as the unknown will nominally produce a k-ratio of unity for all elements present. Typically, k-ratios will fall in a range from 0 to 10 depending on the relative concentration of element Z in the unknown and the standard. A k-ratio less than zero can occur when count statistics and the fitting estimate of the background intensity conspire to produce a slightly negative characteristic intensity. Of course, there is no such thing as negative X-ray counts, and negative k-ratios should be set to zero before the matrix correction is applied. A k-ratio larger than unity happens when the standard generates fewer X-rays than the unknown. This can happen if the standard contains less of the element and/or if the X-ray is strongly absorbed by the standard. Usually, a well-designed measurement strategy won’t result in a k-ratio much larger than unity. We desire to use a standard where the concentration of element Z is high so as to minimize the contribution of the uncertainty in the amount of Z in the standard to the overall uncertainty budget of the measurement, as well as to minimize the uncertainty
19.3 · Sets of k-ratios
contribution of the count statistics in the standard spectrum to the overall measurement precision. The ideal standard to maximize concentration is a pure element, but for those elements whose physical and chemical properties prohibit them from being used in the pure state, for example, gaseous elements such as Cl, F, I, low melting elements such as Ga or In, or pure elements which deteriorate under electron bombardment, for example, P, S, a binary compound can be used, for example, GaP, FeS2, CuS, KCl, etc.
TIP
To get the most accurate trace and minor constituent measurements, it is best to average together many k-ratios from distinct measurements before applying the matrix correction. Don’t truncate negative k-ratios before you average or you’ll bias your results in the positive direction.
19.2\ Uncertainties ink-ratios
All k-ratio measurements must have associated uncertainty estimates. The primary source of uncertainty in a k-ratio measurement is typically count statistics although instrumental instability also can contribute. X-ray emission is a classic example of a Poisson process or a random process described by a negative exponential distribution.
Negative exponential distributions are interesting because they are “memoryless.” For a sequence of events described by a negative exponential distribution, the likelihood of an event’s occurring in an interval τ is equally as likely regardless of when the previous event occurred. Just because an event hasn’t occurred for a long time doesn’t make an event any more likely in the subsequent time interval. In fact, the most probable time for the next event is immediately following the previous.
If X-rays are measured at an average rate R, the average number of X-rays that will be measured over a time t is N = R · t. Since the X-ray events occur randomly dispersed in time, the actual number measured in a time t will rarely ever be exactly N = R · t. Instead, 68.2 % of the time the actual number measured will fall within the interval (N –
N, N + N) where N ~ N1/2 when N is large (usually true for X-ray counts). This interval is often called the “one sigma” interval. The one-sigma fractional uncertainty is thus N/N1/2 = 1/N1/2, which for constant R decreases as t increased. This is to say that generally, it is possible to make more precise measurements by spending more time making the measurement. All else remaining constant, for example, instrument stability and specimen stability under electron bombardment, a measurement taken for a duration of 4 t will have twice the precision of a measurement take for t.
Poisson statistics apply to both the WDS and EDS measurement processes. For WDS, the on-peak and background measurements all have associated Poissonian statistical
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uncertainties. For EDS, each channel in the spectrum has an associated Poissonian statistical uncertainty. In both cases, the statistical uncertainties must be taken into account carefully so that an estimate of the measurement precision can be associated with the k-ratio.
The best practices for calculating and reporting measurement uncertainties are described in the ISO Guide to Uncertainty in Measurement (ISO 2008). Marinenko and Leigh (2010) applied the ISO GUM to the problem of k-ratios and quantitative corrections in X-ray microanalytical measurements. In the case of WDS measurements, the application of ISO GUM is relatively straightforward and the details are in Marinenko and Leigh (2010). For EDS measurements, the process is more complicated. If uncertainties are associated with each channel in the standard and unknown spectra, the k-ratio uncertainties are obtained as part of the process of weighted linear squares fitting.
19.3\ Sets ofk-ratios
Typically, a single compositional measurement consists of the measurement of a number of k-ratios—typically one or more per element in the unknown. The k-ratios in the set are usually all collected under the same measurement conditions but need not be. It is possible to collect individual k-ratios at different beam energies, probe doses or even on different detectors (e.g., multiple wavelength dispersive spectrometers or multiple EDS with different isolation windows).
There may more than one k-ratio per element. Particularly when the data is collected on an energy dispersive spectrometer, more than one distinct characteristic peak per element may be present. For period 4 transition metals, the K and L line families are usually both present. In higher Z elements, both the L and M families may be present. This redundancy provides a question – Which k-ratio should be used in the composition calculation?
While it is in theory possible to use all the redundant information simultaneously to determine the composition, standard practice is to select the k-ratio which is likely to produce the most accurate measurement. The selection is non- trivial as it involves difficult to characterize aspects of the measurement and correction procedures. Historically, selecting the optimal X-ray peak has been something of an art. There are rules-of-thumb, but they involve subtle compromises and deep intuition.
This subject is discussed in more detail in Appendix 19.A. For the moment, we will assume that one k-ratio has been selected for each measured element.
k = { kZ : Z elements } |
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Our task then becomes converting this set of k-ratios into an estimate of the unknown material’s composition.
C = {CZ : Z elements } |
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(19.4) |
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